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Jinglifeng Technology also has been engaged in PCB fabrication for years since it’s establishment ,our main advantages are below
- Free Samples
- favorable price
- pleasing quality
- Short lead time
- Free engineering re-design
Our PCB Products Catalogue
- FR4 single side/double side PCB
- FR4 multilayer PCB
- Flexible PCB
- Rigid-flexi PCB
- High Frequency PCB
- HDI PCB
| PCB FR4 Basematerial | ||
| pcb sheets fr4 — natural color is typically a yellowish to light green. The most versatile all around laminate grades are continuous glass woven fabric impregnated with an epoxy resin binder. Epoxy resins are among the most versatile and widely used plastics in the electronics field, primarily because water absorption is virtually nil, rendering it an outstanding insulator. | ||
| Item | Unit | Value |
| Water absorption | % | <0.25 |
| Flexural strength | MPa | >350 |
| Surface resistivity (C-96/20/65) | MΩ | >105 |
| Volume resistivity(C-96/20/65) | MΩ·m | >104 |
| Dielectric lose factor (1MHz) | — | <0.03 |
| Heat resistance 220°C 20mm | — | No bubble |
| Flammability UL94 (1.6mm) | Class | V-0 |
| Solvent resistance | — | No change |
| Density | g/cm3 | 1.85-1.95 |
| Charpy impact strength | kJ/m2 | >45 |
| Size | mm | 1020×1220 / 1220×1220 / 1220×2480 |
| Note: Colors white, yellow, black, light green are available, the specifications above not applicable in black. | ||
| Factory Manufacture Capability. | ||
| Item | Manufacture Capability | |
| Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant), Aluminium, Metal based/High Frenquency FR-4 Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. | |
| Layer No. | 1-58 layers | |
| Finished Board thickness | 0.2 mm-3.8mm’(8 mil-150 mil) | |
| Board Thickness Tolerance | ±10% | |
| Cooper thickness | 0.5 OZ-11OZ (18 um-385 um) | |
| Copper Plating Hole | 18-40 um | |
| Impedance Control | ±10% | |
| Warp&Twist | 0.70% | |
| Peelable | 0.012″(0.3mm)-0.02’(0.5mm) | |
| Images | ||
| Min Trace Width (a) | 0.1mm (4 mil) | |
| Min Space Width (b) | 0.1mm (4 mil) | |
| Min Annular Ring | 0.1mm (4 mil) | |
| SMD Pitch (a) | 0.2 mm(8 mil) | |
| BGA Pitch (b) | 0.2 mm (8 mil) | |
| Solder Mask | ||
| Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) | |
| Soldermask Clearance (b) | 0.1mm (4 mil) | |
| Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
| Solder Mask Thickness | 0.0007″(0.018mm) | |
| Holes | ||
| Min Hole size (CNC) | 0.2 mm (8 mil) | |
| Min Punch Hole Size | 0.9 mm (35 mil) | |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
| Hole Position Tol | ±0.075mm | |
| Plating | ||
| HASL | 2.5um | |
| Lead free HASL | 2.5um | |
| Immersion Gold | Nickel 3-7um Au:1-5u” | |
| OSP | 0.2-0.5um | |
| Outline | ||
| Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
| Beveling | 30°45° | |
| Gold Finger angle | 15° 30° 45° 60° | |
| Certificate | ROHS, ISO9001:2008, SGS, UL certificate | |